Windsond S1H2 modifications for observations in rain

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Authors: Joshua Soderholm, Kelly A. Lombardo, Matthew R. Kumjian
Cited by: 0

Abstract

Introduction This repository contains 3D model files used to fabricate and modify Windsond S1 radiosondes. The purpose of these modifications is to limit water ingress into the radiosonde electronics during heavy precipitation. A journal article detailing the design and validation can be found here: Link will be added upon publication Printing and Assembly Radiation Shield Print with 0.2 mm layer thickness, 100% infill, and no supports, oriented such that the shield base is on the printing bed. PLA filament is suitable. Printing speed may need to be reduced to prevent print failures. Finished models must be wrapped in adhesive aluminum foil tape to reflect solar radiation. Recommended thickness is 0.04 mm or less. To connect the new radiation shield to the probe arm use the same approach as the original radiation shield - adhesive foil tabs. Note that the probe arm must run through the middle of the radiation shield to allow ventilation. Sensor Support Arm Print with 0.2 mm layer thickness, 100% infill, and no supports, oriented such that the outer long edge is on the printing bed. PLA filament is suitable. Mount by first passing the sensor through the support arm (without a radiation shield). Adhere the support arm to the outside of the polystyrene cup using hot-melt glue. Tether Hole Cover Print with 0.2 mm layer thickness, 100% infill, and no supports, oriented flat on the printing bed. PLA filament is suitable. Ensure the slot remains open, use a craft knife to open it as needed. Place tether through the cover and carefully pull so no slack remains (be careful not to break the tether). Adhere the cover only to the tether using hot melt glue. Additional Recommendations Seal the power switch using a small piece of waterproof tape. Be careful not to touch the exposed T/RH sensor during assembly. All model files are in millimeters

Fields of Study & Subjects

Arduino and IoT Applications Additive Manufacturing and 3D Printing Technologies Meteorological Phenomena and Simulations

Publication details

Journal / source
Zenodo (CERN European Organization for Nuclear Research)
Publication date
13 January 2026
Document type
Dataset