AI-Controlled Pressure-Assisted Droplet SpinOn Dielectric Process for Wafer Interconnects

Point-Droplet Spin-On Dielectric (Droplet SOD): Localized dielectricdeposition directly on vias or microtrenches to reduce voids and minimizeunnecessary material coverage.AI-Controlled Process: High-resolution wafer scanning and AI algorithmsdetermine droplet volume, precise location, and deposition sequence.Closed-loop feedback adjusts in real-time.Pressure-Assisted Microdroplet Delivery: Piezoelectric or pressureassisted dispensing ensures accurate droplet placement and improvedfilling of high-aspect-ratio vias.