AI-Governed Thermally Activated MicroContact Interconnect Concept

This proposal outlines a system-level concept in which thermally activatedmicro-contact structures are combined with AI-driven closed-loop processcontrol to enable stable, self-aligned interconnect formation during standardthermal processes (e.g., reflow or controlled heating).Rather than introducing new active materials or biological elements, the conceptfocuses on governable material behavior, where micro-scale thermaldeformation or wetting is actively monitored and stabilized by AI at the processlevel.The approach challenges the traditional assumption that interconnect materialsmust be intrinsically stable, proposing instead that behavioral variability can bemanaged and constrained through real-time sensing and AI control.