Математическое моделирование тепло- и массообменных процессов при взаимодействии капли припоя с подложкой
Abstract
The purpose of the research is modeling of physical heatexchange processes that are proceeding when the drop of liquid solder is put on the metal backing. The mathematical model that was created allows to research the influence of different physical parameters on the quality of soldering and to optimize this process.
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Heat Transfer and Numerical Methods
Welding Techniques and Residual Stresses
Publication details
- Journal / source
- Zenodo (CERN European Organization for Nuclear Research)
- Publication date
- 8 February 2026