Pre-Filled Solder Reservoir with Solidified Solder for PCB Modular Connection

Modern electronic modules increasingly demand reliable, repeatable, and modular vertical connections between PCB substrates and removable modules. Traditional BGA or solder ball solutions face challenges in: 、Precision alignment 、Volume-controlled soldering 、Long-term reliability in modular applications This proposal presents a PCB-level pre-filled solder reservoir system combined with pre-formed solidified solder, enabling modules to be inserted and permanently connected via a single reflow process.