Unified Architecture for Scalable Quantum Computing: A Modular Superconducting Platform with Digital Twin Integration

This work presents a conceptual architecture and technological roadmap for a scalable superconducting quantum computing platform based on modular design principles. Rather than introducing a new qubit technology, the proposal focuses on addressing critical engineering bottlenecks that currently limit the large-scale deployment of quantum processors, including wiring complexity, electromagnetic crosstalk, fabrication yield, and latency in error-correction feedback loops.The proposed framework introduces a modular hybrid architecture (“Quantum Mesh”), where medium-scale quantum chiplets containing 25–50 superconducting transmon qubits are interconnected through advanced 3D packaging and cryogenic infrastructure. This approach aims to improve manufacturing yield, reduce wiring density, and enable rack-level integration of quantum processing units while maintaining high gate fidelities and manageable thermal loads.A second central element of the proposal is the integration of a high-fidelity digital twin environment capable of simulating qubit dynamics, noise sources, control latency, and thermal constraints at nanosecond resolution. This predictive framework is intended to support hardware iteration cycles prior to fabrication, potentially accelerating design optimization and system validation.The document outlines a three-year development pathway targeting 100–200 physical qubits and several logical qubits using surface code error correction, followed by a longer-term scaling strategy toward quantum fabrics exceeding one thousand qubits. By combining modular quantum chiplets, partial cryogenic electronics, and predictive digital twin modeling, the proposed architecture explores a plausible industrial pathway toward large-scale quantum computing systems.