The influence of the thickness of cuo thin films obtained by the spray pyrolysis method on the electro-physical properties
Abstract
Thin copper oxide (CuO) films were obtained by the spray pyrolysis technique, with the deposition time varied between 5 and 15 minutes. The effect of thickness on the morphological, wettability, and electrical properties was investigated using atomic force microscopy (AFM), contact angle measurements, current - voltage (I - V) characteristics, resistivity, and X-ray diffraction (XRD). The results indicated an increase in roughness from 10 nm to 16 nm and in contact angle from 108° to 118° as the deposition time increased, reflecting an improvement in hydrophobicity. At the same time, an increase in electrical current and a decrease in resistivity from 3.5×10⁶ Ω·cm to 5×10⁵ Ω·cm were observed. XRD analysis confirmed the formation of the monoclinic CuO crystalline phase, demonstrating the structural stability of the films. These results indicate that deposition parameters can be adjusted to control the functional properties of the films, making them promising for electronic and optoelectronic applications.
Fields of Study & Subjects
Copper-based nanomaterials and applications
ZnO doping and properties
Chalcogenide Semiconductor Thin Films
Publication details
- Pages
- 124–129
- Publication date
- 1 February 2026
- Language
- EN