Data underlying the article "Co-Packaged Electronics with Microfluidics for Direct-to-Package Cooling"

Figshare 2026 Dataset Open access

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Authors: Henry Martin
DOI: 10.6084/m9.figshare.31073227
Cited by: 0

Abstract

The approach of co-packaging electronics with microfluidics for direct-to-package cooling has been demonstrated in this paper. The dataset provided displays the post-processed experimental data to reproduce the results demonstrated in this study.

Fields of Study & Subjects

Heat Transfer and Optimization Heat Transfer and Boiling Studies 3D IC and TSV technologies

Publication details

Journal / source
Figshare
Publication date
1 January 2026
Document type
Dataset