Clause AI-4: SRAM Thermal Integrity Bound for Fused Attention Kernels

Executive Summary: This specification defines the SRAM Thermal Integrity Bound, a physical-layer compliance constraint for GPU-accelerated AI inference. It addresses the reliability gap where standard JEDEC qualification protocols (JESD47/JESD94A) fail to account for the hyper-localized thermal stress induced by Fused Attention Kernels in modern Transformer workloads.The Problem: Fused kernels (like FlashAttention) maximize SRAM residency to reduce HBM bandwidth, creating sustained "hotspots" that accelerate aging and increase the probability of Silent Data Corruption (SDC). Current schedulers treat thermal headroom as a global aggregate, masking localized violations that lead to non-deterministic inference failures.The Solution: Clause AI-4 establishes a formal thermal envelope for SRAM banks during fused kernel execution. It bridges the gap between software optimization (kernel fusion) and hardware physics (electromigration/NBTI), providing the "Hardware Contract" required for safety-critical AI deployments under ISO 26262 and IEC 61508.