Supplement Number 1

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Authors: Juan Lago, Verónica González Fernández, Alison Hoe, Michael T. Barako, Patrick Shamberger
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Abstract

Supplementary Figs. 1-7, Table 1, and References. These figures include detailed characterization of the copper foam, examples of experimentally measured temperatures and thermal impedance data, calorimetry data of the PCM, and parameters used in 1D finite difference thermal modeling.

Publication details

Journal / source
AIP Publishing
Publication date
1 January 2026