Thermal shock chamber
Abstract
An environmental testing device that rapidly subjects products to alternating extreme high and low temperatures to test their durability and reliability.
Fields of Study & Subjects
Electronic Packaging and Soldering Technologies
Reliability and Maintenance Optimization
Mechanical and Thermal Properties Analysis
Publication details
- Journal / source
- PolyU Institutional Research Archive (Hong Kong Polytechnic University)
- Publication date
- 15 January 2026