Research Progress of Liquid Jet Cooling for High Heat Flux Devices

With the ongoing trend toward higher integration and greater power output in electronic devices， heat flux densities are steadily increasing， posing severe challenges for thermal management technologies. Among the various approaches， liquid jet cooling has emerged as a promising candidate for kilowatt-level heat dissipation owing to its exceptionally high local heat transfer coefficients and excellent spatial adaptability. This review systematically summarizes the fundamental principles and recent advances in jet cooling with a particular focus on the heat transfer mechanisms and characteristics of single jets， jet arrays， and phase-change jet boiling. Current studies indicate that confined jet arrays can effectively enhance temperature uniformity and critical heat flux （CHF） at the impingement surface， while staggered nozzle arrangements significantly mitigate adverse cross-flow effects， thereby improving the flow stability and heat transfer performance. Furthermore， incorporating micro/nanoscale surface structures at the jet impingement interface significantly increases the number of nucleation sites and heat transfer area， leading to a substantial enhancement in boiling heat transfer. Key influencing factors， such as the working fluid properties， nozzle geometry， system flow rate， and liquid subcooling， critically determine the cooling performance. Nevertheless， further exploration is required to address challenges such as adaptability to non-uniform heat fluxes， development of environmentally friendly low-GWP working fluids， multi-scale structure optimization， and integration of hybrid cooling systems. Through coordinated optimization across multiple factors， jet cooling technology holds significant potential for overcoming extreme heat dissipation bottlenecks and providing reliable thermal management solutions for next-generation high-power electronic devices.